In the race for technological supremacy, one thing US politicians seem to universally agree on is the necessity for America to stay ahead. Ensuring such leadership, especially in fields like chipmaking and AI, will be a critical task for the next US president. The previous administrations have taken significant steps, such as the CHIPS Act of 2022, which earmarked $280 billion to bolster microchip production domestically and reduce reliance on foreign technology.
Laurie E. Locascio, undersecretary of standards and technology at the US Department of Commerce and director of the National Institute of Standards and Technology (NIST), is at the forefront of managing these investments. She emphasizes the importance of developing new chip designs and manufacturing techniques to secure America’s technological future in AI. According to Locascio, chip packaging—the method of integrating different components to enhance performance—will be crucial for the next wave of AI advancements.
In a recent conversation with WIRED senior writer Will Knight, Locascio discussed how generative AI and ChatGPT have influenced US microchip priorities. “During Covid, we faced shortages of essential chips. Now, the focus is on advanced chips. AI is changing the game across industries, making AI-specific chips a top priority,” she explained.
The CHIPS Act, Locascio notes, is not just about bringing current technology back to the US. It also aims to foster innovation in chip manufacturing. The Act allocates $11 billion for research and development and $39 billion for manufacturing, recognizing that innovation must drive manufacturing and vice versa. “We are developing new technologies in tandem with the R&D community to ensure our manufacturing capabilities remain cutting-edge,” she said.
A significant portion of this focus is on “advanced packaging”—a crucial component for developing three-dimensional chip architectures that enhance AI performance. “We recently announced a $1.6 billion initiative specifically targeting areas such as power and thermal requirements for AI chips,” Locascio added.
Packaging is vital for creating advanced chip architectures that boost AI capabilities and drive the AI revolution forward. Locascio highlighted the importance of materials and substrates in this process, noting their role in the efficiency of hyperscale computing within data centers.
Turning to her role at NIST, Locascio also oversees the development of AI standards and practices. While the AI Safety Institute is still in its early stages, NIST is working on guidelines for AI model testing and is engaged with global AI safety institutes. However, rigorous research on potential existential risks from artificial general intelligence is still limited.
Regarding AI benchmarks and measuring AI’s impact on the economy, Locascio acknowledged the challenges. “We need to innovate responsibly and ensure technology serves us well,” she said, emphasizing the importance of trust in AI technologies.
In summary, Locascio’s insights underscore that to maintain its leadership in AI, the US must advance both chip technology and AI standards, integrating new innovations and ensuring robust safety practices.
I’m a finance writer with three years of experience in investment analysis. At Investorwelcome , I translate complex financial concepts into clear, actionable insights to help investors navigate the market with confidence. Combining my solid academic background with practical industry knowledge, I’m dedicated to providing readers with accurate and timely information. My goal is to empower both new and seasoned investors by simplifying intricate data and offering strategic advice. When I’m not writing, I stay engaged with market trends and investment innovations to ensure my content remains relevant and valuable.
